Title :
Recovery of Copper from Bio-leaching Solutions of Waste Printed Circuit Boards Waste by Ion Exchange
Author :
Chenglong, Zhang ; Yujia, Cai ; Jingwei, Wang ; Jianfeng, Bai ; Yuan, Zhou ; Wenjie, Wu ; Wenxiong, Mao
Author_Institution :
Sch. of Environ. Eng., Shanghai Second Polytech. Univ., Shanghai, China
Abstract :
According to the properties of bioleaching solutions of printed circuit boards (PCBs), copper in the leaching solution were recovery by ion exchange with macroporous styrene iminodiacetic acid chelating resin D401. The bed height of resin, flow rate, pH value on copper adsorption had been studied. Work Exchange Capacity (WEC) of copper increased with increasing bed height of resin and flow rate. The copper WEC of 7.88 mg/mL can be obtained with pH 2.5 and 200 mm bed height at flow rate of 2 mL/min. More than 99.5% of copper could be eluted from loaded resin to get the copper enriched solution by 1.0 M sulphuric acid at A/R ratio 20 in at flow rate of 2 mL/min. Results of the present investigation indicated that D401 resin can efficiently recovery copper from bioleaching solution of PCBs.
Keywords :
copper; electronics industry; ion exchange; leaching; printed circuits; resins; waste recovery; Cu; D401 chelating resin; bioleaching solutions; copper adsorption; copper recovery; ion exchange; macroporous styrene iminodiacetic acid; waste printed circuit boards; work exchange capacity; Bioleaching Copper; Ion exchange; Resin; Waste printed circuit boards;
Conference_Titel :
Digital Manufacturing and Automation (ICDMA), 2010 International Conference on
Conference_Location :
ChangSha
Print_ISBN :
978-0-7695-4286-7
DOI :
10.1109/ICDMA.2010.428