Title :
Timing characterization and layout of a low power differential C2MOS flip flop in 0.35μm technology
Author :
Dendouga, A. ; Bouguechal, N. ; Barra, S. ; Manck, O.
Author_Institution :
Adv. Electron. Lab., Batna Univ., Batna
Abstract :
The chip developed (UltraSonic Low Voltage SAP for General Electric Medical) in co-operation of AEL (Advenced Electronic Laboratory university of Batna) and MAZ Brandenburg has been produced with 0.35 mum CMOS technology from AMS. The receiver sub-aperture processor is designed to handle the information from ultra-sonic transducer elements inside the probe handler. It performs basic analogue signal processing, and passes the output signal to a host system via a coax cable. Violations in the timing constraints of a clocked flip flop can cause a synchronous system to malfunction. The effects of variations in the power supply voltage (VDD) on the timing characteristics of registers are investigated in this paper. The relations of the setup/hold time and data propagation delay to power supply variations are demonstrated for different cases (nominal case, best case and worst case).
Keywords :
CMOS logic circuits; coaxial cables; delays; flip-flops; integrated circuit layout; low-power electronics; ultrasonic transducers; analogue signal processing; coaxial cables; data propagation delay; differential CMOS flip-flop; hold time; integrated circuit layout; power supply variation; probe handler; receiver sub-aperture processor; setup time; size 0.35 mum; synchronous system; timing characterization; ultrasonic transducer; Biomedical transducers; CMOS technology; Laboratories; Low voltage; Power supplies; Probes; Process design; Signal processing; Timing; Ultrasonic transducers; Clocked CMOS; Hold time; Low power flip flop; Propagation delay; Setup time; Timing characterization;
Conference_Titel :
Signals, Circuits and Systems, 2008. SCS 2008. 2nd International Conference on
Conference_Location :
Monastir
Print_ISBN :
978-1-4244-2627-0
Electronic_ISBN :
978-1-4244-2628-7
DOI :
10.1109/ICSCS.2008.4746891
