Title :
Application of surface mount technology for biomedical microsensor interconnections
Author :
Mundt, Carsten ; Ash, Bruce ; Ufer, Stefan ; Buck, R.P. ; Nagle, H. Troy
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
A method of connecting flexible electrode arrays to a flat cable or a flexible circuit is described. Solderpaste printing and reflow soldering techniques (as used in surface mount technology) are used to make a solder connection between a fine pitch flat cable and the bondpads on an electrode array. An epoxy and silicone encapsulation is added to achieve reliable connections for cardiovascular applications
Keywords :
biomedical measurement; biosensors; microelectrodes; reflow soldering; surface mount technology; biomedical microsensor interconnections; cardiovascular applications; connection method; epoxy/silicone encapsulation; fine pitch flat cable; flexible circuit; flexible electrode arrays; reflow soldering techniques; reliable connections; solderpaste printing; surface mount technology; Biomedical electrodes; Bonding; Cardiology; Encapsulation; Flexible printed circuits; Joining processes; Microsensors; Printing; Reflow soldering; Surface-mount technology;
Conference_Titel :
Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-2050-6
DOI :
10.1109/IEMBS.1994.415153
