Simulation and analysis of the electromagnetic behavior of 3D-MCM carried structures by means of investigations on symmetric folded microstrip filters

Simulation and analysis of the electromagnetic behavior of 3D-MCM (multichip module) carrier structures by means of investigation on symmetric folded microstrip filters realised on their basis is proposed in the present paper. The technology for building multilayer high-speed MCM structures, based on Al carriers enables the development of multiple and multilayered interconnections combined with thin film integrated passive components-resistors and MIM capacitors-embedded in the whole structure. In order to study these material systems of interconnections, constructions of multilevel folded symmetric microstrip filters for 1.7 GHz were developed. An electromagnetic simulation of the various filter constructions was performed. RF measurements by means of a vector analyzer were carried out and compared with the simulated characteristics. The obtained measurement and simulation results were used to study successfully the electromagnetic characteristic as well as the parasitic high-frequency effect of interconnection, in order to achieve a reliable practical realisation of high rate production quality