• DocumentCode
    2340936
  • Title

    On capacitance of (Ua=300 V) ionized cluster beam deposited Pb/p-Si(100) Schottky junction

  • Author

    Cvikl, Bruno ; Korosak, Dean

  • Author_Institution
    Fac. of Civil Eng., Maribor Univ., Slovenia
  • fYear
    1998
  • fDate
    5-7 Oct 1998
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    The room temperature C-V characteristics, exhibiting the distinct maxima around the reverse biased voltage, Ur, of ionized cluster beam deposited (ICB) metal/p-Si(100), metal=Pb and Ag, Schottky junctions, are interpreted in terms of the model of metal/metal-enriched interlayer/p-Si substrate structure. It is shown, that the resultant depletion layer capacitance, C, of such a structure, when derived by incorporating the (assumed biased voltage independent) excess interface charge density, σ, in conjunction with the spatially confined deep lying metal impurity levels within the metal enriched semiconductor region, could successfully describe the low frequency C-V data, as measured on these ICB Ua=300 V Schottky junctions
  • Keywords
    Schottky barriers; capacitance; deep levels; impurity states; interface states; ionised cluster beam deposition; lead; semiconductor-metal boundaries; silicon; 300 V; Pb-Si; Pb/p-Si(100) Schottky junction; Si; capacitance; depletion layer; excess interface charge density; ionized cluster beam deposited; low frequency C-V data; metal/metal-enriched interlayer/p-Si substrate structure; reverse biased voltage; room temperature C-V characteristic; spatially confined deep lying metal impurity levels; surface potential; Capacitance measurement; Capacitance-voltage characteristics; Current measurement; Density measurement; Frequency; Ion beams; Semiconductor impurities; Substrates; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices and Microsystems, 1998. ASDAM '98. Second International Conference on
  • Conference_Location
    Smolenice Castle
  • Print_ISBN
    0-7803-4909-1
  • Type

    conf

  • DOI
    10.1109/ASDAM.1998.730181
  • Filename
    730181