Title :
Heat transfer in product patterned silicon semiconductor substrate
Author_Institution :
ATMEL Corp., Colorado Springs, CO, USA
Abstract :
This work investigates the heat transfer in semi-transparent medium such as production substrate used in IC´s manufacturing. First, an experimental proof is provided showing that semiconductor (silicon) substrate is a semi-transparent material. Second, volumetric power absorption during thermalization of incident irradiation is calculated for typical condition encountered in RTP processing.
Keywords :
elemental semiconductors; heat radiation; heat transfer; rapid thermal processing; silicon; thermal conductivity; IC manufacturing; RTP; Si; heat transfer; semitransparent material; silicon semiconductor substrate; thermalization; volumetric power absorption; Absorption; Heat transfer; Inorganic materials; Optical distortion; Optical materials; Semiconductor device manufacture; Semiconductor materials; Silicon; Substrates; Ultraviolet sources;
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on
Print_ISBN :
0-7803-7874-1
DOI :
10.1109/RTP.2003.1249126
