• DocumentCode
    2342578
  • Title

    Technology development of integrated multi-modal and flexible tactile skin for robotics applications

  • Author

    Engel, Jonathan ; Chen, Jack ; Wang, Xuefeng ; Fan, Zhifang ; Liu, Chang ; Jones, Douglas

  • Author_Institution
    Micro & Nanotechnol. Lab., Illinois Univ., Urbana, IL, USA
  • Volume
    3
  • fYear
    2003
  • fDate
    27-31 Oct. 2003
  • Firstpage
    2359
  • Abstract
    We report the development of a multi-modal, flexible tactile sensing skin based on polymer substrates and integrated micromachining technology with increased mechanical robustness relative to silicon tactile devices. This polymer-based tactile skin is very unique because it includes the following sensing modalities beyond surface roughness and contact force measurement: thermal conductivity, hardness, temperature, and its own curvature. These new modalities allow the demonstrated tactile sensors to characterize an object or a contact event in a more comprehensive fashion. Sensing is accomplished via thin film metal gold heaters, nickel RTD´s (Resistance Temperature Device), and NiCr (nichrome) strain gauges. Experimental characterization of the sensors´ performance and potential for application to robotics are presented.
  • Keywords
    hardness; micromachining; polymers; robots; strain gauges; surface roughness; tactile sensors; thermal conductivity; NiCr strain gauges; Resistance Temperature Device; contact force measurement; curvature; flexible tactile skin; hardness; integrated micromachining technology; integrated multi modal; mechanical robustness; nichrome; nickel RTD; polymer substrates; robotics applications; silicon tactile devices; surface roughness; tactile sensors; temperature; thermal conductivity; thin film metal gold heaters; Micromachining; Polymers; Robot sensing systems; Robustness; Rough surfaces; Silicon; Skin; Substrates; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems, 2003. (IROS 2003). Proceedings. 2003 IEEE/RSJ International Conference on
  • Print_ISBN
    0-7803-7860-1
  • Type

    conf

  • DOI
    10.1109/IROS.2003.1249223
  • Filename
    1249223