DocumentCode
2342765
Title
Thermal deformation measurement and evaluation of printed circuit board by using holography
Author
Taniguchi, Masanari ; Takagi, Tasuku
Author_Institution
Fac. of Sci. & Technol., Meijo Univ., Nagoya, Japan
fYear
1994
fDate
10-12 May 1994
Firstpage
1527
Abstract
Since a recent trend of miniaturization in electronic system makes the electronic circuit high density on the printed circuit board (PCB), the microscopical deformation measurement of PW due to thermal stress became one of the important problems as the density increases. In this study, using a holographic interferometry measuring technique, the deformation pattern of PCB surface due to heat generated by mounted electronic devices on the PCB was measured
Keywords
deformation; holographic interferometry; printed circuit testing; thermal stresses; PCB; deformation pattern; holographic interferometry; holography; microscopical deformation measurement; miniaturization; printed circuit board; thermal deformation measurement; thermal stress; Circuit testing; Computer graphics; Holography; Integrated circuit testing; Interferometry; Laser beams; Printed circuits; Stress measurement; Surface emitting lasers; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE
Conference_Location
Hamamatsu
Print_ISBN
0-7803-1880-3
Type
conf
DOI
10.1109/IMTC.1994.352192
Filename
352192
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