• DocumentCode
    2343323
  • Title

    Distance relay over-reaching due to SSSC presence on second circuit of double circuit line

  • Author

    Jamali, S. ; Kazemi, A. ; Shateri, H.

  • Author_Institution
    Iran Univ. of Sci. & Technol., Tehran
  • fYear
    2008
  • fDate
    3-5 June 2008
  • Firstpage
    918
  • Lastpage
    923
  • Abstract
    This paper discusses the distance relay overreaching in the case of installation of static synchronous series compensator (SSSC) which is categorized as a series connected flexible alternating current transmission system (FACTS) device, on second circuit of a double circuit transmission line. This is done by presenting the measured impedance at the relaying point in the case of SSSC presence at the far end of the second circuit. The measured impedance at the relaying point is greatly influenced in the presence of SSSC on the transmission line or even in the case of installing SSSC on the far end of the second circuit. The measured impedance at the relaying point depends on many factors including power system structural conditions, the pre-fault loading, the ground fault resistance, SSSC structural and controlling parameters.
  • Keywords
    flexible AC transmission systems; power transmission faults; power transmission lines; power transmission protection; relay protection; static VAr compensators; FACTS device; SSSC; distance relay over-reaching; double circuit transmission line; flexible alternating current transmission system; ground fault resistance; power system structural condition; pre-fault loading; relaying point; static synchronous series compensator; Distributed parameter circuits; Electrical resistance measurement; Flexible AC transmission systems; Flexible printed circuits; Impedance measurement; Power system relaying; Power transmission lines; Protective relaying; Relays; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2008. ICIEA 2008. 3rd IEEE Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1717-9
  • Electronic_ISBN
    978-1-4244-1718-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2008.4582649
  • Filename
    4582649