Low-stress silicon nitride for insulating multielectrode arrays

Author

James, Kristofer J. ; Normann, Richard A.

Author_Institution

Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA

fYear

1994

fDate

1994

Firstpage

836

Abstract

Discusses the use of low-stress silicon nitride for the insulation of a silicon-based multielectrode array. Tested parameters include adhesion, resistance, and biocompatibility. Adhesion of the silicon nitride to silicon test strips and resistance measurements made during accelerated life testing show favorable results. Initial biocompatibility testing has shown that the material is non-toxic. These initial findings make low-stress silicon nitride a promising material for the insulation of multielectrode arrays

Keywords

adhesion; biomedical equipment; encapsulation; insulating materials; microelectrodes; silicon compounds; Si₃N₄; accelerated life testing; biocompatibility; low-stress silicon nitride; multielectrode arrays insulation; nontoxic material; resistance measurements; silicon test strips; silicon-based multielectrode array; Adhesives; Biological materials; Dielectric materials; Electrodes; Frequency; Immune system; Insulation; Platinum; Silicon; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE

Conference_Location

Baltimore, MD

Print_ISBN

0-7803-2050-6

Type

conf

DOI

10.1109/IEMBS.1994.415170

Filename

415170