Title :
Application of the transient liquid phase bonding to microelectronics and MEMS packaging
Author :
Park, Jin-Woo ; Eagar, Thomas W.
Author_Institution :
Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
Abstract :
For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern in such applications. In this paper, the partial transient liquid phase bonding (PTLPB) method for ceramic-to-metal joining is reviewed. This method does not require high joining pressure and stringent surface preparation for cleanliness as in diffusion bonding. With a proper selection of filler metals, this method can produce more heat-resistant joints than those manufactured by brazing. In this study, Si3N4 has been successfully joined to Inconel 718 using PTLPB with thin multi-layers of Ti-Cu, Ti-Ni and Ti-Cu-Ni at temperatures lower than 1000°C. The interfacial structure has been investigated using SEM and TEM. The processing conditions for high joint strength are also discussed
Keywords :
ceramic packaging; integrated circuit packaging; interface structure; joining processes; micromechanical devices; scanning electron microscopy; transmission electron microscopy; 1000 C; Inconel 718; MEMS packaging; SEM; TEM; Ti-Cu; Ti-Cu multilayer; Ti-Cu-Ni; Ti-Cu-Ni multilayer; Ti-Ni; Ti-Ni multilayer; ceramic package; ceramic-to-metal joining; filler metal; heat resistance; interfacial structure; joint strength; microelectronic packaging; partial transient liquid phase bonding; silicon nitride; Ceramics; Diffusion bonding; Electronic packaging thermal management; Filler metals; Microelectronics; Micromechanical devices; Plastic packaging; Soldering; Temperature; Wafer bonding;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990362
