DocumentCode :
2344540
Title :
Interface degradation and dielectric breakdown of thin oxides due to homogeneous charge injection
Author :
Kerber, M. ; Schwalke, U.
Author_Institution :
Siemens AG, Munich, West Germany
fYear :
1989
fDate :
11-13 Apr 1989
Firstpage :
17
Lastpage :
21
Abstract :
The interface stability of 9- to 20-nm gate oxides is evaluated during homogeneous charge injection. In addition, the question of the extent to which interface degradation is correlated to dielectric breakdown is addressed. The measurements reveal that thinner oxides are more resistant to interface degradation. In addition, significantly reduced charge trapping in thin oxides results in improved threshold voltage stability. For both gate polarities, oxide breakdown exhibits no direct correlation to interface state density
Keywords :
electric breakdown of solids; elemental semiconductors; interface electron states; semiconductor-insulator boundaries; silicon; silicon compounds; 9 to 20 nm; Si-SiO2; charge trapping; dielectric breakdown; gate polarities; homogeneous charge injection; interface degradation; interface stability; interface state density; thin oxides; threshold voltage stability; Annealing; Capacitors; Degradation; Dielectric breakdown; Electric breakdown; Electron traps; Interface states; Oxidation; Stability; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
Conference_Location :
Phoenix, AZ
Type :
conf
DOI :
10.1109/RELPHY.1989.36311
Filename :
36311
Link To Document :
بازگشت