• DocumentCode
    2344571
  • Title

    Polarity dependence of thin oxide wearout

  • Author

    Dumin, D.J. ; Dickerson, K.J. ; Hall, M.D. ; Brown, G.K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
  • fYear
    1989
  • fDate
    11-13 Apr 1989
  • Firstpage
    28
  • Lastpage
    33
  • Abstract
    The properties of less than 10-nm-thick silicon oxide films have been measured as a function of substrate type, oxide thickness, stress polarity, stress voltage, geometry, and fluence to help define the physical processes involved in wearout and breakdown. Changes that have been observed in the I-V, I-t, and C-V characteristics of 10-nm-thick oxides on p-type substrates as a function of stress and measurement polarity are reported. The differences in trap generation and charge trapping that occur during and following the high-voltage stressing of thin oxides are discussed
  • Keywords
    electric breakdown of solids; interface electron states; life testing; metal-insulator-semiconductor structures; semiconductor-insulator boundaries; C-V characteristics; I-V characteristics; I-t characteristics; MOS capacitors; Si-SiO2; breakdown; charge trapping; fluence; geometry; high-voltage stressing; oxide thickness; p-type substrates; stress polarity; stress voltage; substrate type; thin oxide wearout; trap generation; Breakdown voltage; Capacitance-voltage characteristics; Capacitors; Electron traps; Instruments; Laboratories; Silicon; Stress measurement; Substrates; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
  • Conference_Location
    Phoenix, AZ
  • Type

    conf

  • DOI
    10.1109/RELPHY.1989.36313
  • Filename
    36313