Reliability of electrically conductive adhesives

Author

Kudtarkar, Santosh Anil ; Morris, James E.

Author_Institution

Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

2002

fDate

2002

Firstpage

144

Lastpage

150

Abstract

This paper presents data on various ICA reliability tests on electro migration, galvanic corrosion and impact resistance. Ag-loaded ICA samples are prepared with both Ag and Cu metallization pads. Some of these samples are then cured with and with out pre heating. These samples are then successively dropped from heights between one and six feet. Drop test performance is affected by the curing profile detail. Some samples are also subjected to 85/85 humidity tests to study electromigration and galvanic corrosion. Copper and silver boards are used for this and their results are then compared

Keywords

adhesives; conducting materials; corrosion; electromigration; impact testing; metallisation; reliability; Ag; Ag-loaded ICA; Cu; copper board; curing process; drop test; electrically conductive adhesive; electromigration; galvanic corrosion; humidity test; impact resistance; metallization pad; reliability; silver board; Conductive adhesives; Copper; Corrosion; Curing; Electric resistance; Galvanizing; Heating; Independent component analysis; Metallization; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Conference_Location

Stone Mountain, GA

Print_ISBN

0-7803-7434-7

Type

conf

DOI

10.1109/ISAPM.2002.990378

Filename

990378