Title :
Electrical overstress of nonencapsulated aluminum bond wires
Author :
King, Randy ; Van Schaick, Connie ; Lusk, Joseph
Author_Institution :
Hewlett-Packard, Santa Rosa, CA, USA
Abstract :
Electrical overstress of nonencapsulated aluminum bond wires is studied by several methods. Time-to-failure experiments, strobe microphotography, and thermal finite-element modeling are used to examine the overstress process. Computer simulations then provide approximate solutions to a more general case. Failure analysts may use these results to estimate overstress current and duration from physical evidence
Keywords :
aluminium; electrostatic discharge; failure analysis; finite element analysis; lead bonding; metallisation; computer simulation; electrical overstress; failure analysis; nonencapsulated Al bond wires; overstress current; strobe microphotography; thermal finite-element modeling; time to failure; Aluminum; Bonding; Computer simulation; Earth Observing System; Failure analysis; Finite element methods; Heat transfer; Microscopy; Switches; Wire;
Conference_Titel :
Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
Conference_Location :
Phoenix, AZ
DOI :
10.1109/RELPHY.1989.36336
