DocumentCode :
2344960
Title :
Down stream oxidation of silicon using an ECR microwave plasma disk reactor
Author :
Salbert ; Reinhard ; Asmussen, J.
Author_Institution :
Michigan State Univ., East Lansing, MI, USA
fYear :
1989
fDate :
0-0 1989
Firstpage :
155
Abstract :
Summary Form only given, as follows. A microwave plasma disk reactor (MPDR) is being used to develop a low-temperature method for growing high-quality oxides on silicon wafers. The MPDR is used as an electrodeless, low-maintenance, high-density source of energetic oxygen ions and free radicals which are applied in the anodic growth of oxides on silicon. It is excited in a tuned, single resonant mode for efficient coupling to the plasma. A 7.6-cm-diameter silicon wafer has been oxidized using a 2.45-GHz multicusp electron cyclotron resonant MPDR. To cover the wafer area uniformly, a low-pressure, downstream approach is used. Plasma diffusion lengths are sufficiently large that uniform downstream plasmas result. Uniformity of oxide thickness across the wafer surface and oxide growth have been studied by ellipsometric and stylus techniques as a function of the downstream distance from the plasma discharge.<>
Keywords :
oxidation; plasma applications; silicon; surface chemistry; 2.45 GHz; 7.6 cm; ECR microwave plasma disk reactor; O; anodic growth; diffusion lengths; downstream oxidation; ellipsometric techniques; energetic ions; free radicals; high-quality oxides; ion source; low-temperature method; multicusp electron cyclotron resonant MPDR; oxide thickness; single resonant mode; stylus techniques; tuned mode; uniform downstream plasmas; Oxidation; Plasma applications; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1989. IEEE Conference Record - Abstracts., 1989 IEEE International Conference on
Conference_Location :
Buffalo, NY, USA
Type :
conf
DOI :
10.1109/PLASMA.1989.166268
Filename :
166268
Link To Document :
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