DocumentCode
2345122
Title
Fundamental analyses of fixture tooling design for flexible substrate assembly
Author
Chen, Ruijun ; Baldwin, Daniel F.
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
2002
Firstpage
285
Lastpage
290
Abstract
This paper focuses on developing a theoretical foundation of fixture tooling design for double-side thin flexible substrate assembly. A thin flexible substrate populated with electronic components on the first side is defined as a closed thermodynamics system. It experiences internal energy change, assembly load work input, and heat transfer during an isothermal assembly process on the second side. Based on the First and Second Laws of Thermodynamics, a new fixturing analysis methodology is developed for studying theoretical fixturing solution of minimizing the assembly load work. The Network locating principle is proposed as a locating method of establishing a datum reference frame on the thin flexible substrate with the minimum fixturing interference to the isothermal assembly process. Using a commercial Siemens´ Siplace placement machine, the predictive capability of the Network locating principle is verified in a series of placement experiments on the thin flexible substrate
Keywords
assembling; substrates; thermodynamics; Network locating principle; Siplace placement machine; closed thermodynamical system; electronic component; fixture tooling design; fixturing analysis; flexible substrate assembly; heat transfer; internal energy; isothermal assembly; load work; Assembly; Electronic components; Fixtures; Flexible printed circuits; Flip chip; Integrated circuit technology; Isothermal processes; Laboratories; Mechanical engineering; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location
Stone Mountain, GA
Print_ISBN
0-7803-7434-7
Type
conf
DOI
10.1109/ISAPM.2002.990400
Filename
990400
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