Title :
The properties of Al-Cu/Ti films sputter deposited at elevated temperatures and high DC bias
Author :
Hariu, T. ; Watanabe, K. ; Inoue, M. ; Takada, T. ; Tsuchikawa, H.
Author_Institution :
Fujitsu Ltd., Kawasaki, Japan
Abstract :
Bias sputtering is an effective method for improvement of step coverage. However, the electromigration lifetime of bias-sputtered Al films is inferior to unbiased film. The lifetime of Al-Cu(2-wt.%)/Ti layered films is improved when Al-Cu layer is deposited at high temperature (500°C) and with substrate bias (-600 V). Here, the influence of the substrate temperature and bias lifetimes is studied and the effect of the impinged Ar atoms on the Al-Cu film lifetimes is discussed
Keywords :
aluminium alloys; copper alloys; electromigration; life testing; metallisation; sputtered coatings; titanium; 500 degC; AlCu-Ti layered films; bias sputter deposition; electromigration lifetime; high DC bias; high temperature deposition; impinged Ar atoms; step coverage; substrate bias; substrate temperature; Argon; Backscatter; Chemicals; Etching; Fluorescence; Grain size; Scanning electron microscopy; Spectroscopy; Temperature; Voltage;
Conference_Titel :
Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
Conference_Location :
Phoenix, AZ
DOI :
10.1109/RELPHY.1989.36347
