High frequency characteristics of liquid crystal polymer for system in a package application

Author

Zou, Gang ; Grönqvist, Hans ; Starski, Piotr ; Liu, Johan

Author_Institution

Div. of Electron. Production, Chalmers Univ. of Technol., Goteborg, Sweden

fYear

2002

fDate

2002

Firstpage

337

Lastpage

341

Abstract

Liquid crystal polymer (LCP) is a promising substrate for electronics packaging. In this paper, the high frequency characteristics of LCP were investigated using a microstrip ring resonator to verify the possibility of the application of the material in microwave packaging. A GaAs MMIC switch circuit was fabricated using LCP as substrate to demonstrate an application of this material for system in a package. From the high frequency measurements, it is shown that LCP has low dielectric constant and low loss tangent that make it useable in high frequency packaging

Keywords

III-V semiconductors; MMIC; dielectric losses; gallium arsenide; integrated circuit packaging; liquid crystal polymers; microstrip resonators; microwave switches; permittivity; substrates; GaAs; GaAs MMIC switch circuit; dielectric constant; electronic packaging; high-frequency characteristics; liquid crystal polymer; loss tangent; microstrip ring resonator; microwave packaging; substrate material; system-in-a-package; Crystalline materials; Dielectric materials; Electronics packaging; Frequency; Gallium arsenide; Liquid crystal polymers; MMICs; Microstrip resonators; Optical ring resonators; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Conference_Location

Stone Mountain, GA

Print_ISBN

0-7803-7434-7

Type

conf

DOI

10.1109/ISAPM.2002.990408

Filename

990408