• DocumentCode
    2345262
  • Title

    Experience gained manufacturing HDI PWBs

  • Author

    Rapala-Virtanen, T.

  • Author_Institution
    Aspocomp Group, Salo, Finland
  • fYear
    2002
  • fDate
    3-6 March 2002
  • Firstpage
    348
  • Lastpage
    355
  • Abstract
    Aspocomp has been manufacturing HDI PWBs at Salo for more than five years. The chief focus has been on increasing packaging density and on accommodating the needs of future chip scale packages. In volume production, cost and performance have to be balanced. As a result, manufacturing and material yields, process automation, the cost of materials and added value technologies like embedded passives are key considerations in meeting the high volume requirements of the marketplace. This paper will describe how these parameters have evolved over time and how it has been possible to achieve the stringent tolerances required in both the manufacturing and assembly processes.
  • Keywords
    chip scale packaging; printed circuit manufacture; tolerance analysis; HDI PWB manufacturing; assembly process; chip scale package; embedded passive; manufacturing process; manufacturing yield; material cost; material yield; packaging density; process automation; tolerance analysis; volume production; Chip scale packaging; Costs; Dielectric liquids; Dielectric materials; Manufacturing automation; Manufacturing processes; Production facilities; Resins; Resistors; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
  • Conference_Location
    Stone Mountain, GA, USA
  • Print_ISBN
    0-7803-7434-7
  • Type

    conf

  • DOI
    10.1109/ISAPM.2002.990410
  • Filename
    990410