DocumentCode
2346035
Title
1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
fYear
1998
fDate
22-27 Feb. 1998
Abstract
The following topics were dealt with: SiC technologies; Si and SOI technologies; III-V electronics/electro-optics and boron technologies; metallizations; passive components, packaging and reliability
Keywords
electric sensing devices; high-temperature electronics; III-V electro-optics; III-V electronics; SOI technology; Si technology; SiC technology; boron technology; devices; high temperature electronic materials; metallization; packaging; passive components; reliability; sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
High-Temperature Electronic Materials, Devices and Sensors Conference, 1998
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-4437-5
Type
conf
DOI
10.1109/HTEMDS.1998.730634
Filename
730634
Link To Document