Influence of short circuits on data of contact and via open circuits determined by a novel weave test structure

Author

Hess, Christopher ; Weiland, Larg H.

Author_Institution

Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany

fYear

1995

fDate

22-25 Mar 1995

Firstpage

11

Lastpage

16

Abstract

The influence that short circuits have on contact hole open circuits and via hole open circuits in regular string test structures will be investigated. To detect open circuits as well as short circuits in adjacent conducting layers of backend process steps, a novel weave test structure (WTS) is presented. Numerous contact strings or via strings are arranged inside boundary pads like a woven piece of cloth. Thus, short circuits between different strings are also electrically detectable

Keywords

electrical contacts; integrated circuit metallisation; integrated circuit testing; short-circuit currents; backend process; boundary pads; conducting layer; contact hole open circuits; defects; electrical detection; short circuits; string test structure; via hole open circuits; weave test structure; Circuit testing; Contacts; Fault tolerance; Manufacturing processes; Parameter extraction; Semiconductor device manufacture; Semiconductor device testing; Semiconductor devices; Semiconductor diodes;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 1995. ICMTS 1995. Proceedings of the 1995 International Conference on

Conference_Location

Nara

Print_ISBN

0-7803-2065-4

Type

conf

DOI

10.1109/ICMTS.1995.513937

Filename

513937