• DocumentCode
    2346498
  • Title

    Silicon carbide power semiconductors — new opportunities for high efficiency

  • Author

    Friedrichs, Peter

  • Author_Institution
    SiCED Electron. Dev. GmbH & Co. KG, Siemens Co., Erlangen
  • fYear
    2008
  • fDate
    3-5 June 2008
  • Firstpage
    1770
  • Lastpage
    1774
  • Abstract
    After a hype and a consolidation phase regarding the potential of silicon carbide based components in power electronics (mostly diodes and switches), we are observing a solid penetration of these components in modern solutions even for power ratings of several kW. Benefits of these new power devices are now more clearly identified and applications were depicted where the use of these new components, in particular Schottky barrier diodes available from Infineon and Cree, can be a technical and commercial access. For a further market penetration, new generations of diodes as well as powerful switching devices are released recently resp. ready to commercialization. Especially upcoming markets for high voltage power devices offering not only high power densities, but energy saving as well push these developments. Supported by the improvements in base material quality and size, SiC power devices are believed to be on the hop to a next important step regarding its propagation in a broader range of applications. The paper will sketch these recent developments and will show how the improved performance can provide new perspectives in conventional systems as well as new solutions.
  • Keywords
    Schottky diodes; power semiconductor devices; Cree; Infineon; Schottky barrier diodes; SiC power devices; consolidation phase; power electronics; silicon carbide power semiconductors; Commercialization; Power electronics; Power generation; Power semiconductor switches; Schottky barriers; Schottky diodes; Semiconductor diodes; Silicon carbide; Solids; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2008. ICIEA 2008. 3rd IEEE Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1717-9
  • Electronic_ISBN
    978-1-4244-1718-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2008.4582824
  • Filename
    4582824