DocumentCode :
2347246
Title :
Determination of solid solubility limit of In and Sb in Si using bonded silicon-on-insulator (SOI) substrate
Author :
Sato, A. ; Suzuki, K. ; Horie, H. ; Sugii, T.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
fYear :
1995
fDate :
22-25 Mar 1995
Firstpage :
259
Lastpage :
263
Abstract :
An SOI substrate enables us to obtain high, even distribution of impurity concentration in ion implantation with subsequent high-temperature annealing. We evaluated the solid solubility limit of In and Sb in Si by Hall measurement. We found that the solid solubility of In was constant at 1.5×1018 cm-3 between 800°C and 1100°C, while that of Sb varied from 7×1019 cm-3 at 800°C to 1.2×1020 cm-3 at 1100°C, both of which were higher than previously reported values
Keywords :
Hall effect; annealing; antimony; elemental semiconductors; indium; ion implantation; semiconductor doping; silicon; silicon-on-insulator; solid solubility; substrates; wafer bonding; 800 to 1100 C; Hall measurement; Si:In; Si:Sb; bonded SOI substrate; high-temperature annealing; impurity concentration; ion implantation; solid solubility; Annealing; Bonding; Conductivity; Doping profiles; Electrical resistance measurement; Impurities; Ion implantation; Silicon on insulator technology; Solids; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1995. ICMTS 1995. Proceedings of the 1995 International Conference on
Conference_Location :
Nara
Print_ISBN :
0-7803-2065-4
Type :
conf
DOI :
10.1109/ICMTS.1995.513984
Filename :
513984
Link To Document :
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