Title :
Spotting the phenomenon of bad smells in MobileMedia product line architecture
Author :
Kaur, Manpreet ; Kumar, Pranaw
Author_Institution :
PG Dept. of Comput. Sci. & IT, Lyallpur Khalsa Coll., Jalandhar, India
Abstract :
Product line engineering a very new engineering method evolved in few past years has proven a very best technique of producing products at rapid way using the concept Reuse of assets, artifacts, and components. Software Product Lines and Software Architectures combined to form a Product Line Architecture (PLA). Many researchers have work on PLA producing different views and experiences. Architectural smells a way of accessing the PLAs, means the identification of bad smells in context of architectures formed using product line. “Why these smells occur” is briefly described and also identification has also been shown using analytical and manual analysis. These smells can be remedied but the process is too large to follow, though small systems can be easily remedied or re-factored using various techniques. Architectural smells are remedied by changing the structure and the behaviors of the internal system elements without changing the external behavior of the system. This paper describes MobileMedia Feature Model creation, Component Model creation as PLA for the assessment of Bad smells.
Keywords :
mobile computing; object-oriented programming; software architecture; software product lines; PLA; architectural smells; artifact reusing; asset reusing; bad smell assessment; component model creation; component reusing; internal system elements; mobilemedia feature model creation; mobilemedia product line architecture; product line engineering; software architectures; software product lines; Computer architecture; Context; Graphical user interfaces; Organizations; Programmable logic arrays; Software; Visualization; Bad smells; Feature Model; MobileMedia; PLA; SPLs;
Conference_Titel :
Contemporary Computing (IC3), 2014 Seventh International Conference on
Conference_Location :
Noida
Print_ISBN :
978-1-4799-5172-7
DOI :
10.1109/IC3.2014.6897200