DocumentCode
2348073
Title
Thermal Analysis of S Band Transmit Module with Air-Cooling System
Author
Cholewa, Jacek
Author_Institution
Telecommun. Res. Inst., Warsaw
fYear
2007
fDate
9-12 Sept. 2007
Firstpage
1970
Lastpage
1975
Abstract
The paper describes results of thermal simulations in S band Transmit Module with air cooling system, carried out using FLOTHERM software. Influence of air-cooling system parameters on temperature distribution in module was also investigated. Additionally, results of thermal simulation of High Power Amplifier are presented. These results were compared with photos taken by an infrared camera in order to show correctness of computed results.
Keywords
air conditioning; power amplifiers; temperature distribution; FLOTHERM software; S band transmit module; air-cooling system; high power amplifier; temperature distribution; thermal analysis; Antenna arrays; Cameras; Computational modeling; Electronic equipment testing; High power amplifiers; Performance analysis; Power system modeling; Power transistors; Temperature; Transmitting antennas; Air-Cooling System; Flotherm; Thermal Analysis; Transmit Module;
fLanguage
English
Publisher
ieee
Conference_Titel
EUROCON, 2007. The International Conference on "Computer as a Tool"
Conference_Location
Warsaw
Print_ISBN
978-1-4244-0813-9
Electronic_ISBN
978-1-4244-0813-9
Type
conf
DOI
10.1109/EURCON.2007.4400277
Filename
4400277
Link To Document