• DocumentCode
    2348380
  • Title

    Exploiting maximum throughput in 3D multicore architectures with stacked NUCA cache

  • Author

    Khan, Asim ; Kang, Kyungsu ; Kyung, Chong-Min

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2011
  • fDate
    3-5 Oct. 2011
  • Firstpage
    130
  • Lastpage
    135
  • Abstract
    Demands for high performance are growing rapidly and multiple processor cores and huge caches are required to meet these requirements. 3D integration provides us a very bright option to encounter this by integrating numerous cores and cache layers in a single chip. Temperature however becomes a problem in 3D integration due to increased power density. A methodology to exploit maximum performance while keeping the temperature under a given limit has been proposed in this paper. We have solved for the optimum clock frequencies, cache capacity and the placement of cache banks for each core to get the maximum throughput. Experiments are done on multiple benchmark programs and a peak 53% and an average 49% improvement in performance as compared to the base case which assigns same frequency and number of banks to each core is found.
  • Keywords
    cache storage; multiprocessing systems; power aware computing; temperature; 3D multicore architecture; maximum throughput; multiple processor core; power density; stacked NUCA cache; temperature; Benchmark testing; Clocks; Delay; Multicore processing; Power demand; Three dimensional displays; Throughput; 3D Integrated Circuits; Instructions per second; Non uniform Cache Architecture; Temperature management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4577-0171-9
  • Electronic_ISBN
    978-1-4577-0169-6
  • Type

    conf

  • DOI
    10.1109/VLSISoC.2011.6081634
  • Filename
    6081634