DocumentCode
2348380
Title
Exploiting maximum throughput in 3D multicore architectures with stacked NUCA cache
Author
Khan, Asim ; Kang, Kyungsu ; Kyung, Chong-Min
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear
2011
fDate
3-5 Oct. 2011
Firstpage
130
Lastpage
135
Abstract
Demands for high performance are growing rapidly and multiple processor cores and huge caches are required to meet these requirements. 3D integration provides us a very bright option to encounter this by integrating numerous cores and cache layers in a single chip. Temperature however becomes a problem in 3D integration due to increased power density. A methodology to exploit maximum performance while keeping the temperature under a given limit has been proposed in this paper. We have solved for the optimum clock frequencies, cache capacity and the placement of cache banks for each core to get the maximum throughput. Experiments are done on multiple benchmark programs and a peak 53% and an average 49% improvement in performance as compared to the base case which assigns same frequency and number of banks to each core is found.
Keywords
cache storage; multiprocessing systems; power aware computing; temperature; 3D multicore architecture; maximum throughput; multiple processor core; power density; stacked NUCA cache; temperature; Benchmark testing; Clocks; Delay; Multicore processing; Power demand; Three dimensional displays; Throughput; 3D Integrated Circuits; Instructions per second; Non uniform Cache Architecture; Temperature management;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4577-0171-9
Electronic_ISBN
978-1-4577-0169-6
Type
conf
DOI
10.1109/VLSISoC.2011.6081634
Filename
6081634
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