• DocumentCode
    2348513
  • Title

    Designs for improving the performance of an electro-thermal in-plane actuator

  • Author

    Kwan, Alex Man Ho ; Song, Sichao ; Lu, Xing ; Lu, Lei ; Teh, Ying Khai ; Teh, Ying Fei ; Chong, Eddie Wing Cheung ; Gao, Yan ; Hau, William ; Zeng, Fan ; Wong, Man ; Huang, Chunmei ; Taniyama, Akira ; Makino, Yoshihide ; Nishino, So ; Tsuchiya, Toshiyuki

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2011
  • fDate
    3-5 Oct. 2011
  • Firstpage
    220
  • Lastpage
    225
  • Abstract
    Reported presently are two designs to improve the performance of a “chevron” electro-thermal in-plane actuator. One incorporates beams with uniform cross-sections but nonuniform lengths and tilt angles to accommodate the thermally induced expansion of the “shuttle”; the other incorporates beams with non-uniform cross-sections to achieve a wider spread of the high temperature “expansion” regions of the beams. With the product of the actuation force and displacement defined as a figure-of-merit, it is verified using finite-element simulation that the incorporation of non-uniform lengths and tilt angles, and non-uniform beam cross-sections leads to respective improvement of 10 and 65% in the figure-of-merit. The effectiveness of these designs was also tested by micro-fabricating actuators occupying fixed device areas.
  • Keywords
    finite element analysis; microactuators; microfabrication; chevron actuator; electro-thermal in-plane actuator; finite-element simulation; micro-fabricating actuators; non-uniform beam cross-sections; Actuators; Heating; Chevron actuator; electro-thermal in-plane actuator; optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4577-0171-9
  • Electronic_ISBN
    978-1-4577-0169-6
  • Type

    conf

  • DOI
    10.1109/VLSISoC.2011.6081641
  • Filename
    6081641