• DocumentCode
    234874
  • Title

    Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection

  • Author

    Chaoqi Zhang ; Hyung Suk Yang ; Bakir, Muhannad S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    13
  • Lastpage
    19
  • Abstract
    This paper reports novel interconnect technologies to enable a large scale `interposer tile´ and `silicon bridge´ interconnection platform. Microfabricated self-alignment structures enable high alignment accuracy between the components. Mechanically flexible interconnects (MFIs) are utilized to enable rematable electrical interconnects. Moreover, a proof of concept demonstration with interposer tiles directly mounted on FR4 board and interconnected by silicon bridges is reported.
  • Keywords
    fine-pitch technology; integrated circuit interconnections; silicon; FR4 board; MFIs; electrical interconnects; highly scalable pitch; mechanically flexible interconnect technologies; mechanically flexible interconnects; self-alignment structures; silicon bridge interconnection platform; silicon interposer tile; Assembly; Bridges; Coatings; Resistance; Resists; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897260
  • Filename
    6897260