Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board

The existing configuration of the JESD22-B111 test board does not impose identical strains during drop test on all the 15-components on the test board, requiring a large numbers of boards to develop meaningful life distributions. Two new candidate designs intended to serve as replacements for the JEDEC JESD22-B111 test board have been analyzed. Configuration-A includes four components located symmetrically on a square 3-inch × 3-inch printed circuit board. Configuration-B includes one-component located symmetrically on a square 3-inch × 3-inch printed circuit board. In this paper, explicit finite element models along with high speed imaging in conjunction with 3D DIC measurements have been used to capture transient strain histories at various board locations to quantify the symmetry of loading during a 1500g 0.5 ms shock pulse and 2900g, 0.3 ms shock pulse. The symmetry of the transient mode shapes and interconnect strains has also been quantified.