Title :
Archipelago platform for skin-mounted wearable and stretchable electronics
Author :
Yung-Yu Hsu ; Papakyrikos, Cole ; Raj, Milan ; Dalal, M. ; Pinghung Wei ; Xianyan Wang ; Huppert, Gil ; Morey, Briana ; Ghaffari, Roozbeh
Author_Institution :
MC10 Inc., Cambridge, MA, USA
Abstract :
In this investigation, the “archipelago” design is presented as a platform for skin-mounted wearable and stretchable electronics. The electronic components of the design were distributed between islands connected by stretchable serpentine structures. The analytical results show that at 20% overall elongation, the serpentines stretch 60% due to the rigidity of the islands. This 20% elongation is defined as the system stretchability. The 60% elongation on the serpentines is defined as the effective stretchability. At 60% effective stretch, the calculated equivalent plastic strain in a serpentine interconnect is 0.67%, which is well below the fracture limit of copper. Elongation experiments show that the archipelago structure has the system stretchability up to 76% for one-time-stretching, translating to 228% of the effective stretchability on the serpentines. Fatigue-tension experiments show that at 20% system stretch, the archipelago structure can withstand on average 71,950 cycles without electrical or mechanical degradation.
Keywords :
flexible electronics; fracture; integrated circuit interconnections; integrated circuit modelling; materials testing; plastic deformation; archipelago design; archipelago platform; archipelago structure; copper; electrical degradation; electronic components; elongation experiments; fatigue-tension experiments; fracture limit; mechanical degradation; one-time-stretching; plastic strain; serpentine interconnect; skin-mounted wearable electronics; stretchable electronics; stretchable serpentine structures; system stretchability; Equations; Finite element analysis; Mathematical model; Metals; Plastics; Resistance; Strain;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897280