DocumentCode
2349223
Title
Characteristics of amorphous tungsten nitride diffusion barrier for metal-organic chemical vapor deposited Cu metallization
Author
Kim, Yong Tae ; Lee, Chang Woo ; Kwon, Chul Soon ; Min, Suk-Ki ; Park, Sang Kyu
Author_Institution
Korea Institute of Science and Technology
fYear
1994
fDate
1994
Firstpage
44414
Lastpage
45510
Keywords
Amorphous materials; Chemical technology; Conductivity; Copper; Metallization; Semiconductor films; Sputtering; Substrates; Tungsten; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
Type
conf
DOI
10.1109/EDMS.1994.863820
Filename
863820
Link To Document