• DocumentCode
    2350155
  • Title

    Interaction between metal packages and the enclosed MMICs

  • Author

    Bolz, Th. ; Neuhaus, B. ; Beyer, A.

  • fYear
    2005
  • fDate
    2005
  • Firstpage
    145
  • Lastpage
    148
  • Keywords
    Admittance; Current density; Equivalent circuits; Green´s function methods; Impedance; MMICs; Packaging; Transmission line matrix methods; Transmission line theory; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
  • Print_ISBN
    0-7803-8861-5
  • Type

    conf

  • DOI
    10.1109/WAMIC.2005.1528404
  • Filename
    1528404
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2350155