Title :
Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)
Abstract :
The following topics were dealt with: flip chip, BGA and packaging; manufacturing process and product improvement; board level assembly; reliability and test; semiconductor processing; emerging technologies in electronics manufacturing; environmentally conscious manufacturing; electronic systems reliability; interconnect; modelling
Keywords :
electron device manufacture; BGA; board level assembly; electronic manufacturing technology; electronic systems reliability; environmentally conscious manufacturing; flip chip; interconnect; modelling; packaging; reliability; semiconductor processing; testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-4523-1
DOI :
10.1109/IEMT.1998.730927
