• DocumentCode
    235021
  • Title

    High frequency high current point of load modules with integrated planar inductors

  • Author

    Wenli Zhang ; Yipeng Su ; Gilham, David ; Mingkai Mu ; Qiang Li ; Lee, Fred C.

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    504
  • Lastpage
    511
  • Abstract
    Planar inductors made by mixed laminates of commercially available low-fire Ni-Cu-Zn ferrite tapes and metal-flake composites developed by NEC-TOKIN have been used for the high density integration of point-of-load (POL) modules. The incremental permeability and core loss density were characterized on the toroidal samples under high dc bias. Measurement results demonstrate that both materials are suitable for applications in high frequency high current POL converters. In order to realize a high power density POL module, a multilayer ferrite inductor laminated with alternating layers of ESL 40010 and ESL 40012 in a 1:1 ratio has been fabricated and integrated with the active layer using modified low temperature co-fired ceramics (LTCC) processing. Meanwhile, the standard printed circuit board (PCB) processing has been adopted for the POL integration with a PCB embedded inductor using metal-flake composite materials. These developed 3-dimensional (3-D) integration approaches can be used to reduce the footprint and increase the power density for the high frequency high current POL converter. It is demonstrated that the power efficiency of POL modules with integrated planar inductors can achieve above 87% at operating frequency of 2 MHz and output current of 15 A. Additionally, no obvious efficiency degradation was observed on the integrated POL modules after certain numbers of thermal cycling from -40 °C to +150 °C.
  • Keywords
    ceramics; copper; ferrite devices; inductors; nickel; power convertors; printed circuits; three-dimensional integrated circuits; zinc; 3D integration process; Ni-Cu-Zn; PCB embedded inductor; core loss density; current 15 A; frequency 2 MHz; high current point-of-load converter; high density integration; high frequency point-of-load converter; incremental permeability; integrated planar inductor; load module high current point; load module high frequency point; low fire ferrite tape; low temperature cofired ceramics processing; metal-flake composite material; point-of-load module; printed circuit board processing; temperature -40 C to 150 C; Fabrication; Ferrites; Inductors; Laminates; Nonhomogeneous media; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897331
  • Filename
    6897331