DocumentCode :
235030
Title :
Package embedded inductors for integrated voltage regulators
Author :
Lambert, William J. ; Hill, Michael J. ; Radhakrishnan, Krishnaja ; Wojewoda, Leigh ; Augustine, Anne E.
Author_Institution :
Assembly & Test Technol. Dev., Intel Corp., Chandler, AZ, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
528
Lastpage :
534
Abstract :
Intel® 4th generation Core™ microprocessors are powered by high frequency integrated switching voltage regulators. The inductors required to implement these regulators were constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the simulation and measurement of these embedded inductors including representative results from production packages.
Keywords :
flip-chip devices; microprocessor chips; voltage regulators; Intel 4th generation core microprocessors; high frequency integrated switching voltage regulators; integrated voltage regulators; organic flip chip packaging; package embedded inductors; routing layers; Electrical resistance measurement; Frequency measurement; Impedance; Inductors; Probes; Regulators; Routing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897335
Filename :
6897335
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=235030
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