Title :
Characterization of on-die power supply noise in FCBGA (Flip-chip ball grid array) packages
Author :
Baek, Hyunho ; Eisenstadt, William R.
Author_Institution :
Univ. of Florida, Gainesville, FL, USA
Abstract :
In this work, the authors demonstrate Core-type and IO-type on-die noise characterization to enhance CPU PDN (Power Delivery Network) performance in microprocessor. The two representative power supply noise characteristics are simulated using excitation models and an impedance modeled of the power delivery network. Then, the design metrics for the PDN are analyzed based on excitation. Behavior of PDN current activity is also estimated in order to be anticipated the power supply noise efficiently.
Keywords :
ball grid arrays; flip-chip devices; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; microprocessor chips; power supply circuits; FCBGA; IO-type on-die noise; core-type on-die noise; flip-chip ball grid array packages; microprocessor power delivery network; on-die power supply noise; Clocks; Impedance; Integrated circuit modeling; Microprocessors; Noise; Power supplies; Resonant frequency;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897339
