Title :
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
Author :
Bing Dang ; Webb, Benjamin ; Tsang, Cornelia ; Andry, Paul ; Knickerbocker, J.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
This paper reviews the recent progress in temporary wafer handling technologies for 3D/2.5D wafer integration. Several critical factors in the selection of a temporary wafer handler technology for 3D/2.5D integration will be discussed and some recommendations are made.
Keywords :
integrated circuit bonding; three-dimensional integrated circuits; 3D-2.5D integration; temporary wafer handler selection; temporary wafer handling technology; Bonding; Glass; Silicon; Thermal resistance; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897343
