• DocumentCode
    2350805
  • Title

    6J-3 Design of Test Modules for the Characterization of SAW Duplexer Inserts by Measurement

  • Author

    Koch, Robert D. ; Pitschi, F. Maximilian ; Kiwitt, Jurgen E. ; Fleckenstein, Andreas ; Weigel, Robert

  • Author_Institution
    Univ. of Erlangen-Nuremberg, Erlangen
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    1065
  • Lastpage
    1068
  • Abstract
    Due to the growing demand for miniaturization and functionality of modern mobile W-CDMA terminals, current developments for integrating SAW or FBAR duplexers into subsystems such as LTCC front-end modules by means of duplexer inserts have been reported recently. We will present the first approach to our knowledge to design test modules for the characterization of SAW duplexer inserts by measurement. The main goal is to characterize the duplexer insert in the environment of an LTCC module without the influence of the other active or passive, mounted or integrated components of the module. This can be achieved by replacing all components, including all metal structures of the LTCC module, with the exception of the duplexer insert, by electrically neutral connections. They have to be well designed for high isolation between the signal paths and have to be optimized for good matching between the PCB and the module. This was realized by using a modified stripline with a slotted ground, which offers both the required high isolation and the required impedance of 50 Omega. Additionally, the PCB-module transition was designed carefully for low reflections. We call the combination of duplexer inserts and neutral connections a test module. By focusing on the design approach of the neutral connection, we will present first samples of test modules with duplexer inserts for W-CDMA 1900
  • Keywords
    code division multiple access; surface acoustic wave devices; LTCC module; PCB-module transition; SAW duplexer inserts; W-CDMA 1900; low temperature cofired ceramic; printed circuit board; stripline; surface acoustic wave; test module design; wideband code division multiple access; Current measurement; Design optimization; Film bulk acoustic resonators; Impedance; Manufacturing; Multiaccess communication; Signal design; Stripline; Surface acoustic waves; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.207
  • Filename
    4152063