An accurate and convenient lumped/discrete port de-embedding method for the 3D integration and packaging full-wave modeling by splitting and absorbing the Error-Cancelling Network

In this paper, an accurate and convenient lumped/discrete port de-embedding method is proposed for full-wave modeling interconnect and packaging components with bump/pin array interfaces in the 3D integration and packaging systems. This method is based on splitting and absorbing the Error-Cancelling Network which was inserted in between two connected S-parameter models to cancel any error by the port parasitic parameters and uncertainty in port current and voltage definitions. In the proposed approach, the Error-Cancelling Network is split into two identical Half-Error-Cancelling networks by making use of the square root of the corresponding T-matrix of the error-cancelling network. Each half-error-cancelling network can be attached to and combined with the original S-parameter models to generate de-embedded S-parameters models without any additional and individual Error-Cancelling Network in appearance. This de-embedding method is a wide-band approach valid on every frequency point in the S-parameter model.