DocumentCode :
235094
Title :
Design, modeling, and characterization of passive channels for data rates of 50 Gbps and beyond
Author :
Beyene, Wendemagegnehu ; Yeon-Chang Hahm ; Secker, David ; Mullen, Don ; Shlepnev, Yuriy
Author_Institution :
Rambus Inc., Sunnyvale, CA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
730
Lastpage :
735
Abstract :
The design of interconnects for links operating at 50 Gbps and beyond is very challenging. The loss, dispersion, and discontinuities along the signaling path have to be minimized over a wide frequency range. Frequency dependent material properties and surface roughness has to be accurately considered. The impacts of short via stubs that are ignored at lower data rates can severely degrade the signals when operating at higher data rates. In order to provide ways to mitigate these effects and optimize the performance of the system, it is primarily essential to correctly model and characterize the passive channel. In this paper, the modeling and characterization techniques that guarantee successful designs of passive channels for data rates of 50 Gbps and beyond will be presented. Detailed studies and measurement results on the effects of short via stubs are also presented.
Keywords :
passive networks; printed circuit design; printed circuit interconnections; surface roughness; bit rate 50 Gbit/s; data rates; discontinuities; dispersion; frequency dependent material properties; interconnect design; loss; passive channel characaterization; passive channel design; passive channel modelling; passive interconnect systems; printed circuit boards; short via stubs; signaling path; surface roughness; Conductors; Copper; Dielectrics; Insertion loss; Laminates; Scattering parameters; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897365
Filename :
6897365
Link To Document :
بازگشت