• DocumentCode
    235102
  • Title

    Analysis on interference between Multi-Giga bit display serial link and RF components in Smart Mobile Device

  • Author

    Youchul Jeong ; Jaemin Kim ; Baegin Sung

  • Author_Institution
    Silicon Image Inc., Sunnyvale, CA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    753
  • Lastpage
    758
  • Abstract
    In Smart Mobile Devices, many components are integrated in a small space while each of them is operating at higher frequency ever. In the case of RF components, they are working at a specific single frequency, and it is relatively easy to avoid the interference by allocating the frequency band adequately. However the digital signal which is used in cutting-edge application processor and Multi-Giga bit display serial link does not have a single frequency but has a broad frequency spectrum, and it is very hard to avoid a frequency conflict between digital components or between digital and RF components. RF components are especially vulnerable to external noise, so the high-speed serial link usually becomes a noise source and RF components become its victim. In this paper, we analyzed noise emissions from various components on a Multi-Giga bit display serial link channel, and we found out how the interference between the link and RF components can be minimized, and signal integrity of the link can be improved by proper design.
  • Keywords
    printed circuits; radiofrequency interference; smart phones; RF components; broad frequency spectrum; cutting-edge application processor; digital signal; external noise; high-speed serial link; interference analysis; multi-giga bit display serial link channel; noise emissions; signal integrity; smart mobile device; Connectors; Copper; Electrostatic discharges; Frequency measurement; Mobile handsets; Noise; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897369
  • Filename
    6897369