• DocumentCode
    235118
  • Title

    Wafer-level non conductive films for exascale servers

  • Author

    Horibe, A. ; Kohara, S. ; Mori, Hisamichi ; Orii, Y. ; Kawamoto, Shota ; Sone, Hidekazu ; Hoshiyama, M.

  • Author_Institution
    IBM Res. - Tokyo, Tokyo, Japan
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    803
  • Lastpage
    807
  • Abstract
    Wafer-Level Non Conductive Films (WLNCFs) were evaluated as a potential underfill solution for future exascale server packages. The fundamental chip-joining ability and reliability on a small die package were tested. The fillet shapes, fillet overcoating, adhesion strength, and simplifications of the chip joining conditions, and the thermomechanical stresses in relation to the lower CTE substrate were evaluated and assessed for the future advanced packages.
  • Keywords
    adhesion; chip scale packaging; films; joining processes; network servers; thermal expansion; wafer level packaging; CTE substrate; WLNCF; adhesion strength; chip joining conditions; chip-joining ability; chip-joining reliability; coefficient of temperature expansion; exascale server packages; fillet overcoating; fillet shapes; potential underfill solution; small die package; thermomechanical stresses; wafer-level non conductive films; Joints; Laminates; Reliability; Servers; Substrates; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897377
  • Filename
    6897377
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235118