DocumentCode
2351282
Title
3I-1 A Lateral Field Excited Sensor Array on a Single Piezoelectric Substrate
Author
Wark, Mitchell ; Winters, Shane ; York, Chris ; Pinkham, Wade ; Bernhardt, George ; Vetelino, John F.
Author_Institution
Lab. for Surface Sci. & Technol., Maine Univ., Qrono, ME
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
880
Lastpage
883
Abstract
Bulk acoustic wave sensors such as the quartz crystal microbalance (QCM) and lateral field excited (LFE) [Hu, et. al., 2004] device have been used for sensing applications in liquid and air. Typical bulk acoustic wave sensing arrays consist of sensors on separate substrates linked by interconnects. Fabricating several sensors on a single piezoelectric substrate offers a simple, reproducible alternative that could potentially reduce the size and cost of multi-parameter sensors. Realizing such an array however can be problematic in terms of acoustic interference between sensing areas for QCM sensors which require electrodes on the sensing surface. In contrast, LFE sensors, which use the transverse shear mode (TSM) as the sensing element, have no electrodes on the sensing surface and are excited by electrodes on the surface opposite the sensing surface. In order to isolate the excited TSM fields for each LFE sensor a heat treatment process proposed by T. Uno [Uno, 1996] is performed. This process inverts the direction of the x-axis of AT-cut quartz in the treated region. Heat treating a piezoelectric crystal focuses and confines acoustic energy at the sensing surface providing the means of constructing an acoustically isolated LFE sensor array on a single piezoelectric substrate
Keywords
bulk acoustic wave devices; heat treatment; microbalances; piezoelectric thin films; quartz; sensor arrays; ultrasonic devices; LFE device; acoustic wave sensor array; heat treatment; lateral field excited device; piezoelectric substrate; quartz crystal microbalance; Acoustic arrays; Acoustic sensors; Acoustic waves; Costs; Electrodes; Heat treatment; Interference; Sensor arrays; Surface treatment; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.236
Filename
4152092
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