• DocumentCode
    2351351
  • Title

    Cycle time estimation for printed circuit board assemblies

  • Author

    Haberle, Katharine R. ; Graves, Robert J.

  • Author_Institution
    Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1998
  • fDate
    19-21 Oct 1998
  • Firstpage
    41
  • Lastpage
    45
  • Abstract
    Competitive pressures force the electronics industry to keep costs down and to reduce product development cycle times. These goals must be accomplished while maintaining product quality and keeping up with current technology. Increasingly, electronics companies are collaborating with other companies to achieve their business goals and to stay competitive. This has taken the form of outsourcing entire operations and services in addition to outsourcing certain components. Such efforts result in a distributed manufacturing environment and places increased stress on the information infrastructure, requiring firms to implement technological changes in order to compete using these business and enterprise practices. The Electronics Agile Manufacturing Research Institute (EAMRI) at Rensselaer Polytechnic Institute was formed to develop tools to support distributed electronics manufacturing environments. As part of this effort, the EAMRI has developed a cycle time estimation model that determines the cycle time or time duration for a PCB assembly before its realization. We model the PCB as going through three stages of realization: design, resource planning, and manufacturing. The cycle time model provides an estimate for each phase based on information available about the PCB before that phase has commenced. This model allows for greater flexibility and insight into planning the PCB development process and in allocating the resources to assure that each PCB meets its schedule. This paper details the development of cycle time estimation models and describes their potential use in a collaborative, distributed manufacturing environment
  • Keywords
    assembling; manufacturing resources planning; outsourcing; printed circuit design; printed circuit manufacture; product development; PCB assembly; PCB design; PCB development process planning flexibility; PCB manufacturing; PCB realization model; PCB resource planning; business goals; business practices; collaborative distributed manufacturing environment; competitiveness; cycle time estimation; cycle time estimation model; cycle time estimation models; cycle time model; distributed electronics manufacturing environments; distributed manufacturing environment; electronics company collaboration; electronics industry; enterprise practices; information infrastructure; manufacturing resources allocation; outsourcing; printed circuit board assemblies; product development cycle time; product quality; technological change; Assembly; Collaboration; Companies; Costs; Electronics industry; Outsourcing; Printed circuits; Product development; Stress; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
  • Conference_Location
    Austin, TX
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-4523-1
  • Type

    conf

  • DOI
    10.1109/IEMT.1998.731015
  • Filename
    731015