• DocumentCode
    2351368
  • Title

    4I-2 Ultrasonic Pulse-Echo NDE of Adhesive Bonds in Sheet-Metal Assemblies

  • Author

    Chapman, G.B. ; Sadler, J. ; Maev, R.G. ; Titov, S. ; Maeva, E.Y. ; Severina, I. ; Severin, F.

  • Author_Institution
    Dept. of Phys., Windsor Univ., Ont.
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    906
  • Lastpage
    909
  • Abstract
    The development of a 20 MHz pulse-echo method for nondestructive evaluation (NDE) of adhesive bonds was undertaken to provide assurance of bond integrity in vehicle body assemblies. This new NDE method features improvements over previous methods implemented in production, and extends the range of bond evaluation effectiveness. The NDE is accomplished by the acquisition and analysis of acoustic echoes that return from bond joints that have interfaces between layers with large acoustical impedance mismatch. These echoes reverberate in the multilayered joint structures and are captured for a computer-automated analysis that provides a rapid interpretation of the indications, and subsequently yields a simplified display of the inspection results
  • Keywords
    adhesive bonding; aerospace industry; automobile industry; inspection; ultrasonic materials testing; vehicles; 20 MHz; acoustical impedance mismatch; adhesive bonds; bond evaluation effectiveness; bond-joint inspection; computer-automated analysis; multilayered joint structures; nondestructive evaluation; sheet-metal assemblies; ultrasonic pulse-echo NDE; vehicle body assemblies; Adhesives; Assembly; Automotive engineering; Bonding; Delay lines; Inspection; Plastics; Probes; Sheet materials; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.242
  • Filename
    4152098