DocumentCode
2351368
Title
4I-2 Ultrasonic Pulse-Echo NDE of Adhesive Bonds in Sheet-Metal Assemblies
Author
Chapman, G.B. ; Sadler, J. ; Maev, R.G. ; Titov, S. ; Maeva, E.Y. ; Severina, I. ; Severin, F.
Author_Institution
Dept. of Phys., Windsor Univ., Ont.
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
906
Lastpage
909
Abstract
The development of a 20 MHz pulse-echo method for nondestructive evaluation (NDE) of adhesive bonds was undertaken to provide assurance of bond integrity in vehicle body assemblies. This new NDE method features improvements over previous methods implemented in production, and extends the range of bond evaluation effectiveness. The NDE is accomplished by the acquisition and analysis of acoustic echoes that return from bond joints that have interfaces between layers with large acoustical impedance mismatch. These echoes reverberate in the multilayered joint structures and are captured for a computer-automated analysis that provides a rapid interpretation of the indications, and subsequently yields a simplified display of the inspection results
Keywords
adhesive bonding; aerospace industry; automobile industry; inspection; ultrasonic materials testing; vehicles; 20 MHz; acoustical impedance mismatch; adhesive bonds; bond evaluation effectiveness; bond-joint inspection; computer-automated analysis; multilayered joint structures; nondestructive evaluation; sheet-metal assemblies; ultrasonic pulse-echo NDE; vehicle body assemblies; Adhesives; Assembly; Automotive engineering; Bonding; Delay lines; Inspection; Plastics; Probes; Sheet materials; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.242
Filename
4152098
Link To Document