• DocumentCode
    2351488
  • Title

    Investigation of body effect of fully depleted n channel SOI device as a function of body bias

  • Author

    Chen, Zongjian ; Ploeg, E.V. ; Shott, John ; Plummer, James D.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • fYear
    1994
  • fDate
    3-6 Oct 1994
  • Firstpage
    57
  • Lastpage
    58
  • Abstract
    There have been several papers on threshold voltage models for fully depleted SOI NMOS devices. The particular case of the fully depleted SOI MOSFET under negative substrate bias has been discussed previously. However all the discussion so far has dealt with the case of low drain bias (typically 0.1 V). The important case of higher drain bias (a typical bias condition in circuits) has not been studied in detail. In this paper, the characterization result from subhalf-micron fully depleted SOI MOSFETs under such bias conditions is presented, followed by an analysis through device simulation which reveals the device physics that determines threshold behavior under such bias conditions
  • Keywords
    MOSFET; semiconductor device models; silicon-on-insulator; MOSFET; bias conditions; body bias; body effect; device physics; device simulation; drain bias; fully depleted n channel SOI device; threshold behavior; Analytical models; Charge carrier processes; Circuit simulation; Fabrication; Impact ionization; MOS devices; MOSFET circuits; Physics; Structural engineering; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1994 Proceedings., 1994 IEEE International
  • Conference_Location
    Nantucket, MA
  • Print_ISBN
    0-7803-2406-4
  • Type

    conf

  • DOI
    10.1109/SOI.1994.514233
  • Filename
    514233