DocumentCode
2351637
Title
Analysis and application of vibration behaviour for wirebonding capillary by transmission laser vibrometer
Author
Tamura, Yoshinari ; Miyahara, Yuichi ; Suzuki, Hiromi
Author_Institution
Semicond. Manuf. Eng. Center, Toshiba Corp., Kawasaki, Japan
fYear
1998
fDate
19-21 Oct 1998
Firstpage
72
Lastpage
75
Abstract
With the application of the proprietary transmission laser vibrometer, we have developed a novel calibration system which enabled the real time acquisition of vibration characteristics of a wirebonding capillary. This system mainly comprises an ultrasonic (US) monitoring unit and the transmission laser vibrometer. Using this calibration system, we could analyze the exact vibration modes of a wirebonding capillary, as well as the correlation between the set parameter for the US oscillator and actual vibration amplitudes of the wirebonding capillary. Therefore, even with the presence of machine to machine differences in vibration characteristics, we could independently obtain appropriate processing parameters for each wirebonder by performing linear calibration of each vibration characteristic against the reference characteristics. Finally, by real time monitoring of US output characteristics, i.e. current, voltage, frequencies, impedance, and phase difference, this system enabled the in-situ detection of abnormal US oscillation. This capability was applied to identify insufficient intermetallic formations during wirebonding and contributed to the reduction of poor bond failures
Keywords
calibration; integrated circuit packaging; integrated circuit reliability; integrated circuit yield; lead bonding; measurement by laser beam; process monitoring; ultrasonic measurement; vibration measurement; US monitoring unit; US oscillator; US output characteristics; bond failures; calibration system; in-situ abnormal US oscillation detection; intermetallic formations; linear calibration; output current; output frequencies; output impedance; output phase difference; output voltage; real time monitoring; real time vibration characteristics acquisition; reference vibration characteristics; transmission laser vibrometer; ultrasonic monitoring unit; vibration amplitudes; vibration behaviour; vibration modes; wirebonder processing parameters; wirebonding; wirebonding capillary; Calibration; Condition monitoring; Frequency; Impedance; Laser modes; Oscillators; Phase detection; Real time systems; Vibrometers; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-4523-1
Type
conf
DOI
10.1109/IEMT.1998.731030
Filename
731030
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