• DocumentCode
    2351924
  • Title

    Qualification of the tape-and-reel packing system ensures quality to the customer

  • Author

    Truesdale, Robert E. ; Brashear, David W. ; Hicks, Timothy G.

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    1998
  • fDate
    19-21 Oct 1998
  • Firstpage
    100
  • Lastpage
    104
  • Abstract
    This paper discusses the purpose of transport media qualification, which is to ensure the highest probability of success in delivering pristine product to the customer. For tape-and-reel, the qualification divides between tests for physical and mechanical conditions, and material and chemical properties. The mechanical testing is the focus of this paper, and includes chip fit analyses, functional line tests, and drop testing. Perhaps the single most critical test of a carrier tape pocket´s ability to provide mechanical part protection is the drop test. The two most important aspects of the drop test are shown to be the use of carefully designed “control lots” to ensure the reliability of the results, and the analysis procedure. In conclusion, recommendations for the criteria for gauging the “success” of these tests are presented
  • Keywords
    circuit reliability; impact testing; materials handling; mechanical testing; printed circuit testing; quality control; surface mount technology; analysis procedure; carrier tape pocket; chemical properties; chip fit analyses; control lots; customer quality; drop test; drop testing; functional line tests; material properties; mechanical conditions; mechanical part protection; mechanical testing; physical conditions; pristine product delivery; quality; reliability; tape-and-reel packing system qualification; tape-and-reel qualification; transport media qualification; Chemicals; Circuit testing; Conducting materials; Drives; Electrostatic discharge; Materials testing; Mechanical factors; Packaging; Protection; Qualifications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
  • Conference_Location
    Austin, TX
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-4523-1
  • Type

    conf

  • DOI
    10.1109/IEMT.1998.731044
  • Filename
    731044