Modeling, design, and demonstration of ultra-miniaturized and high efficiency 3D glass photonic modules

This paper presents the modeling, design, and demonstration of an ultra-miniaturized 2.5D optical transceiver module using ultra-thin glass interposers with electrical and optical through vias. The 3D Glass Photonics (3DGP) technology with double sided attach of electrical and photonics ICs can achieve ultra-high bandwidth with improved power efficiency at lower cost than other photonic integration such as silicon photonics and organic boards. Thin glass substrates with 60um diameter through vias were fabricated with copper plated electrical vias and polymer-filled optical vias, formed simultaneously. Re-distribution layers were fabricated on top of these integrated vias for electrical interconnections. The 2.5D optical module produced this way features flip-chip bonded VCSEL and driver chips. Initial measurements of the optical vias showed 1.2 dB of loss.